APF30-30-06CB

CTS Thermal Management Products

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APF30-30-06CB

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HEATSINK LOW-PROFILE FORGED

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Mfr	CTS Thermal Management Products
Type	Top Mount
Shape	Square, Fins
Width	1.181" (30.00mm)
Length	1.181" (30.00mm)
Series	APF
Package	Box
Diameter	-
Material	Aluminum
Fin Height	0.250" (6.35mm)
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Thermal Tape, Adhesive (Not Included)
Base Product Number	APF30
Thermal Resistance @ Natural	-
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	4.40°C/W @ 200 LFM